Adhesive has exceptionally high thermal conductivity
A two-part epoxy resin system
Master Bond EP21AN is a two-part epoxy resin system with a thermal conductivity >22Btu•inch•ft2•hr•°F. Its dielectric strength of >400 volts/mil and volume resistivity >1013 ohm cm make it an outstanding electrical insulator.
It has a non-critical one-to-one mix ratio by weight or volume and cures readily at ambient temperatures. Its coefficient of thermal expansion is 18-20 x 10-6 in/in/°C.
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