Until recently, the curing of conductive adhesives was a slow process but thanks to new optimised hardener systems, the curing time has been reduced to within a few minutes. For maximum processing and production speed, Panacol have improved several of their one-part Elecolit® range of conductive adhesives so that they can offer a snap cure.
The new Elecolit® silver filled adhesives have improved conductivity both electrically and thermally and are available in a range of viscosities to accommodate various applications and requirements. As the conductivity is strongly dependent on the content of conductive filler, Panacol uses uniquely shaped filling materials to achieve an optimal fill ratio. This ensures high conductivity and consistent product performance.
Chris Dilley, Sales Director at Techsil, said: “The big area at the moment is wearable electronics. Conductive adhesives can be used for bonding electronic components onto flexible substrates that ordinary solder would melt.”
The Elecolit® range from Panacol provides an extensive product portfolio of one and two part conductive adhesives suitable for: Shielding and ESD protection, Electrically conductive contacting and bonding of conducting paths within the electronic field, Electrically conductive bonding on circuit boards and PCBs, Die bonding and Flip chips.
Contact: technical@techsil.co.uk for more information
www.techsil.co.uk
