500 papers and posters on multiphysics simulation now available for public access

COMSOL is excited to announce the availability of the latest in multiphysics simulation presented at the COMSOL Conference. Browse through hundreds of papers on topics ranging from structural mechanics, CFD, heat transfer, electromagnetics, acoustics, and chemical engineering, and find inspiration for your next design.

The 2017 COMSOL Conference, held in seven locations across the globe, brought together thousands of engineers, researchers, and designers worldwide. Attendees connected and exchanged best practices in mathematical modelling and multiphysics simulation. Keynote presentations were delivered by industry leaders such as Amgen, W. L. Gore and Associates, and STMicroelectronics. Attendees also got a behind the scenes look at how these organizations develop their designs. Many talks shared how to capitalise on the power of multiphysics modelling by expanding its reach through custom simulation apps.

Users of the COMSOL Multiphysics® software presented posters and papers sharing their work and insights of numerical simulation. Areas covered include structural mechanics, CFD, heat transfer, electromagnetics, acoustics, and chemical engineering. Engineers from MIT, Oak Ridge National Laboratory, and Beth Israel Deaconess Medical Center, among others showed how they are using multiphysics simulation to advance their work. To learn from others, browse through the hundreds of papers and posters that are now publicly available online at http://uk.comsol.com/c/6kkz.

Best Paper and Best Poster Awards

The 2017 COMSOL Conference kicked off in Boston before heading to Rotterdam, Beijing, Singapore, Taipei, Seoul, and Tokyo. Each location had a programme committee of simulation specialists from industry and academia review the submissions and select the winners. The winners recognised with Best Paper and Best Poster awards can be found at http://uk.comsol.com/c/6l63.