Using LDS (laser direct structuring) combined with a galvanic production line which is specifically developed for plating copper on 3D printed parts. The LDS process is accomplished with an LPKF Microline 3D 160i direct image structuring machine.
The newly installed metallisation system is suitable for prototype production and plating of LDS components. The electroplating machinery required for production was obtained from Laser Micronics, who since November 2016 no longer provide 3D-MID as a service. Beta LAYOUT therefore offers a complete service for three-dimensional circuit carriers from one source as well as laser structuring. Through it's website, customers can request a price quotation for 3D MID prototypes based on laser-sintered 3D printing, including component assembly.
3D-MIDs technology complements conventional circuit board technology and is used by the industry for space-saving circuit carrier solutions.
The latest edition of Beta LAYOUT’s 3D-MID design software, TARGET 3001! V18 PCB-POOL, is available for free from the company’s website. It is claimed to be the first free ECAD software for designing electronic circuits on three-dimensional circuit carriers and offers an integrated 3D-MID function enabling schematic creation and the ability to place circuitry on already created 3D step file data.
