Epoxy potting compound has low viscosity and high flexibility

Written by: Laura Hopperton | Published:

A two-component, flexibilised epoxy potting/encapsulation compound for high performance applications

Master Bond EP30FL is a two-component, flexibilised epoxy potting/encapsulation compound for high performance applications. EP30FL has superior electrical insulation properties and resistance to impact. It is formulated to cure at room temperatures and has exceptionally low shrinkage after cure. EP30FL has high bond strength to similar and dissimilar substrates and will resist 4K to 250°F.
Resistance to thermal cycling and shock is outstanding.

http://masterbond.com/tds/ep30fl.html
e-mail: technical@masterbond.com


This material is protected by MA Business copyright see Terms and Conditions.
One-off usage is permitted but bulk copying is not. For multiple copies contact the sales team.


Related Content

Websites


Companies

Masterbond Adhesive Solutions
Comments
Name
 
Email
 
Comments
 

Please view our Terms and Conditions before leaving a comment.

Change the CAPTCHA codeSpeak the CAPTCHA code