High efficiency heat sinks could replace cooling fans

Written by: Tom Austin-Morgan | Published:

Versarien Technologies has launched of a range of low profile heat sinks using VersarienCu.


VersarienCu reduces the potential size requirement of individual components. The increased thermal efficiency of the copper foam on the component can allow for a cooling fan to be removed from products, and has the additional benefit of increasing the life of a component by reducing overheating.

This range is designed for use in passive cooling applications where space is at a premium and performance is crucial. These VersarienCu heat sinks can be used to cool integrated circuit components, such as power integrated circuits, high temperature components and transistors, set top boxes, AP routers, cable modems and broadband, optical networks and LED TV and flat panel displays.

Neill Ricketts, CEO of Versarien, said: "This is an important development for Versarien Technologies. With the introduction of these standardised products into our range, we are able to offer customers a cost effective solution to their thermal management needs."


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