Engineering publications brought to you by Mark Allen

Knowledge Bank

ANSYS announces winners of 2018 Hall of Fame competition

COMSOL congratulates the 2017 Create the Future Design Contest winners

Modelling low-temperature plasma in COMSOL

MTC develops simulation app to revolutionise design for additively manufactured parts

5G high-speed interconnect design

Making the case for digital exploration

Infographic: Digitization of energy and power

First look at the latest COMSOL Multiphysics software unveiled at the COMSOL Conference 2017

Infographic: Digitization of high-tech

How do I select the correct adhesive? - TechWeb webinar

Multiphysics Simulation 2017 shares the innovative work behind the products that will shape our future

Outperforming mechanical fasteners: Using structural adhesives for structural applications